Addressing the critical market demand for silicon photonic light sources driven by the AI computing power explosion, Hongchen Photonics has officially launched its CW 1310nm DFB high-power series laser chips. Leveraging its forward-looking strategic layout in high-power continuous-wave (CW) laser technology, the company provides a domestically developed high-performance light source solution for core AI computing interconnection scenarios such as 800G/1.6T silicon photonic modules and CPO (Co-Packaged Optics), contributing to breakthroughs in the optical chip supply chain bottleneck.
The Hongchen Photon HC-1550FP-CW01W LD chip complies with Telcordia GR-468 standards, featuring a non-gas-sealed packaging design. It has passed rigorous reliability tests including HTOL (High Temperature Operating Life) and BDH (Biased/Unbiased Damp Heat), meeting all requirements for non-gas-sealed applications. This product is suitable for telecom and related markets.
To meet the demand for long-distance detection in the laser ranging and LiDAR markets, Hongchen Photon has launched its multi-junction series of 905nm pulsed LD chips. Utilizing tunnel junction cascading technology, the chips achieve vertical cascading of up to five PN junctions. By integrating different junction counts and various emitter widths, the company has developed a range of chip specifications tailored to different detection distances and collimation optical paths. Additionally, customized development is available based on specific customer requirements.