Official Announcement: Chengdu Hongchen Photon Semiconductor Technology Co., Ltd. Successfully Certified as a National High-Tech Enterprise

In January 2026, Chengdu Hongchen Photon Semiconductor Technology Co., Ltd. (hereinafter referred to as "Hongchen Photon") successfully passed the national high-tech enterprise certification and officially obtained the High-Tech Enterprise Certificate.

Hongchen Photon's 112GBaud PD chip has passed Telcordia GR-468 standard reliability tests, including 175℃ HTOL (High Temperature Operating Life) and BDH (Biased Damp Heat) evaluations. The chip maintains stable performance without degradation, meeting the stringent requirements for high-speed optical module applications.

To address the growing demand for high-speed optical modules like 1.6T, Hongchen Photon has introduced its Back-illuminated 112 GBaud PD chip. This innovative chip delivers bandwidth exceeding 56GHz and a response rate surpassing 0.7A/W, while its integrated backside lens simplifies coupling in downstream applications. It is capable of meeting the stringent requirements of AI data centers for high-speed, high-responsivity receiver chips.

Chengdu Hongchen Photon has officially launched its self-developed 1550nm narrow-linewidth high-power laser chip. With core performance advantages including ultra-narrow linewidth, high-power output, and ultra-low noise, the chip delivers high-performance photonic solutions for applications such as high-speed communications, intelligent sensing, and LiDAR, marking a significant technological breakthrough in domestic optoelectronic core devices.