Addressing the critical market demand for silicon photonic light sources driven by the AI computing power explosion, Petasemi has officially launched its CW 1310nm DFB high-power series laser chips. Leveraging its forward-looking strategic layout in high-power continuous-wave (CW) laser technology, the company provides a domestically developed high-performance light source solution for core AI computing interconnection scenarios such as 800G/1.6T silicon photonic modules and CPO (Co-Packaged Optics), contributing to breakthroughs in the optical chip supply chain bottleneck.

This newly launched product series has achieved significant commercial milestones: The 70mW and 100mW uncooled laser chips have completed full-process performance development and reliability validation, with all specifications meeting the stringent requirements of silicon photonic integration. The series has now officially entered the small-volume production and delivery stage, enabling rapid response to the light source demands of downstream data centers and AI computing clusters.

In response to the market trend toward higher power levels, the company is simultaneously advancing the R&D of 200mW and 400mW uncooled laser chips. Core technological development is progressing steadily, with full-dimensional performance validation expected to be completed within 2026, further strengthening the high-power CW light source product portfolio.

As the core wavelength for silicon photonic communication, the 1310nm band and its CW DFB lasers serve as the fundamental light source devices for silicon photonic modules and a key alternative solution to alleviate the current supply-demand gap for high-end EML chips. Hongchen Photonics' latest product launch not only fills the market gap for domestically produced high-power CW 1310nm DFB lasers but also strategically positions the company in the AI computing interconnection light source sector through a dual-track strategy of "mass-produced products + high-power R&D reserves."

Looking ahead, the company will continue to focus on core technological innovation in silicon photonic light sources, enhance mass production capabilities and performance metrics, and provide stable, domestically developed light source support for next-generation high-speed optical interconnects and large-scale AI computing infrastructure, accelerating the domestic substitution process for optical chips.

Figure 1. CW 1310nm DFB high-power laser chip

Figure 2. L-I curve of the CW 1310nm DFB high-power laser chip

 Figure 3. Optical spectrum of the CW 1310nm DFB high-power laser chip