To address the growing demand for high-speed optical modules like 1.6T, Petasemi has introduced its Back-illuminated 112 GBaud PD chip. This innovative chip delivers bandwidth exceeding 56GHz and a response rate surpassing 0.7A/W, while its integrated backside lens simplifies coupling in downstream applications. It is capable of meeting the stringent requirements of AI data centers for high-speed, high-responsivity receiver chips.

Petasemi has officially launched its self-developed 1550nm narrow-linewidth high-power laser chip. With core performance advantages including ultra-narrow linewidth, high-power output, and ultra-low noise, the chip delivers high-performance photonic solutions for applications such as high-speed communications, intelligent sensing, and LiDAR, marking a significant technological breakthrough in domestic optoelectronic core devices.

Addressing the critical market demand for silicon photonic light sources driven by the AI computing power explosion, Petasemi has officially launched its CW 1310nm DFB high-power series laser chips. Leveraging its forward-looking strategic layout in high-power continuous-wave (CW) laser technology, the company provides a domestically developed high-performance light source solution for core AI computing interconnection scenarios such as 800G/1.6T silicon photonic modules and CPO (Co-Packaged Optics), contributing to breakthroughs in the optical chip supply chain bottleneck.

The Petasemi HC-1550FP-CW01W LD chip complies with Telcordia GR-468 standards, featuring a non-gas-sealed packaging design. It has passed rigorous reliability tests including HTOL (High Temperature Operating Life) and BDH (Biased/Unbiased Damp Heat), meeting all requirements for non-gas-sealed applications. This product is suitable for telecom and related markets.